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ITF86116SQT
TM
Data Sheet
July 2000
File Number
4808.3
10A, 30V, 0.012 Ohm, N-Channel, Logic Level, Power MOSFET Packaging
TSSOP8
Features
* Ultra Low On-Resistance - rDS(ON) = 0.012, VGS = 10V - rDS(ON) = 0.016, VGS = 4.5V * Gate to Source Protection Diode * Simulation Models - Temperature Compensated PSPICE(R) and SABERTM Electrical Models - Spice and SABER Thermal Impedance Models - www.intersil.com * Peak Current vs Pulse Width Curve * Transient Thermal Impedance Curve vs Board Mounting Area
5 1 23 4
Symbol
DRAIN(1) SOURCE(2) DRAIN(8) SOURCE(7)
* Switching Time vs RGS Curves
Ordering Information
PART NUMBER ITF86116SQT PACKAGE TSSOP-8 86116 BRAND
SOURCE(3) GATE(4)
SOURCE(6) DRAIN(5)
NOTE: When ordering, use the entire part number. ITF86116SQT2 is available only in tape and reel.
Absolute Maximum Ratings
TA = 25oC, Unless Otherwise Specified ITF86116SQT 30 30 20 10.0 9.0 5.0 Figure 4 2 16 -55 to 150 300 260 UNITS V V V A A A A W mW/oC oC
oC oC
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Drain Current Continuous (TA = 25oC, VGS = 10V) (Figure 2) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Continuous (TA = 25oC, VGS = 4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Continuous (TA = 100oC, VGS = 4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL Package Body for 10s, See Technical Brief TB370 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg NOTES: 1. TJ = 25oC to 125oC. 2. 62.5oC/W measured using FR-4 board with 1.00 in2 (645.2 mm2) copper pad at 10 second.
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
1
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures. SABERTM is a trademark of Analogy, Inc. PSPICE(R) is a registered trademark of MicroSim Corporation. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright (c) Intersil Corporation 2000
ITF86116SQT
Electrical Specifications
PARAMETER OFF STATE SPECIFICATIONS Drain to Source Breakdown Voltage Zero Gate Voltage Drain Current Gate to Source Leakage Current ON STATE SPECIFICATIONS Gate to Source Threshold Voltage Drain to Source On Resistance VGS(TH) rDS(ON) VGS = VDS, ID = 250A (Figure 10) ID = 10.0A, VGS = 10V (Figures 8, 9) ID = 5.0A, VGS = 4.5V (Figure 8) THERMAL SPECIFICATIONS Thermal Resistance Junction to Ambient RJA Pad Area = 1.00 in2 (645.2 mm2) (Note 2) Pad Area = 0.035 in2 (22.4 mm2) (Figure 20) Pad Area = 0.0045 in2 (2.88 mm2) (Figure 20) SWITCHING SPECIFICATIONS (VGS = 4.5V) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time SWITCHING SPECIFICATIONS (VGS = 10V) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time GATE CHARGE SPECIFICATIONS Total Gate Charge Gate Charge at 5V Threshold Gate Charge Gate to Source Gate Charge Gate to Drain "Miller" Charge CAPACITANCE SPECIFICATIONS Input Capacitance Output Capacitance Reverse Transfer Capacitance CISS COSS CRSS VDS = 25V, VGS = 0V, f = 1MHz (Figure 12) 1770 390 163 pF pF pF Qg(TOT) Qg(5) Qg(TH) Qgs Qgd VGS = 0V to 10V VGS = 0V to 5V VGS = 0V to 1V VDD = 15V, ID = 9.0A, Ig(REF) = 1.0mA (Figures 13, 16, 17) 34 18.6 2 6.4 7.2 nC nC nC nC nC td(ON) tr td(OFF) tf VDD = 15V, ID = 10.0A VGS = 10V, RGS = 9.1 (Figures 15, 18, 19) 12 63 47 46 ns ns ns ns td(ON) tr td(OFF) tf VDD = 15V, ID = 5.0A VGS = 4.5V, RGS = 8.2 (Figures 14, 18, 19) 21.5 82 29 31 ns ns ns ns 62.5 165.4 206.8
oC/W oC/W oC/W
TA = 25oC, Unless Otherwise Specified SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
BVDSS IDSS IGSS
ID = 250A, VGS = 0V (Figure 11) VDS = 30V, VGS = 0V VGS = 20V
30 -
-
10 10
V A A
1.0 -
0.0086 0.011
2.5 0.012 0.016
V
Source to Drain Diode Specifications
PARAMETER Source to Drain Diode Voltage Reverse Recovery Time Reverse Recovered Charge SYMBOL VSD trr QRR ISD = 9.0A ISD = 9.0A, dISD/dt = 100A/s ISD = 9.0A, dISD/dt = 100A/s TEST CONDITIONS MIN TYP 0.81 27 13.5 MAX UNITS V ns nC
2
ITF86116SQT Typical Performance Curves
1.2 POWER DISSIPATION MULTIPLIER 1.0 0.8 0.6 0.4 0.2 0 12 10 VGS = 10V, RJA = 62.5oC/W 8 6 4 2 0 0 25 50 75 100 125 150 25 50 75 100 125 150 TA , AMBIENT TEMPERATURE (oC) TA, AMBIENT TEMPERATURE (oC) VGS = 4.5V, RJA = 206.8oC/W
FIGURE 1. NORMALIZED POWER DISSIPATION vs AMBIENT TEMPERATURE
3 1 THERMAL IMPEDANCE ZJA, NORMALIZED DUTY CYCLE - DESCENDING ORDER 0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 t2 RJA = 62.5oC/W
0.1
0.01
ID, DRAIN CURRENT (A)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs AMBIENT TEMPERATURE
SINGLE PULSE 0.001 10-5 10-4 10-3 10-2 10-1 100
NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJA x RJA + TA
101 102 103
t, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
1000
RJA = 62.5oC/W
TA = 25oC FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS:
IDM, PEAK CURRENT (A)
100 VGS = 4.5V
I = I25
150 - TA 125
10
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION 10-4 10-3 10-2 10-1 t, PULSE WIDTH (s) 100 101 102 103
5 10-5
FIGURE 4. PEAK CURRENT CAPABILITY
3
ITF86116SQT Typical Performance Curves
500 RJA = 62.5oC/W SINGLE PULSE TJ = MAX RATED TA = 25oC 100s
(Continued)
40 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VDD = 15V 30 TJ = 150oC 20 TJ = 25oC 10 TJ = -55oC 100 0 2.0
ID, DRAIN CURRENT (A)
100
10 OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) 1 1 10
1ms
10ms
ID, DRAIN CURRENT (A)
2.5
3.0
3.5
4.0
VDS, DRAIN TO SOURCE VOLTAGE (V)
VGS, GATE TO SOURCE VOLTAGE (V)
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
FIGURE 6. TRANSFER CHARACTERISTICS
40 VGS = 10V ID, DRAIN CURRENT (A) 30 VGS = 5V VGS = 4.5V 20 VGS = 3.5V 10 TA = 25oC 0 0 0.2 0.4 0.6 0.8 1.0 VDS, DRAIN TO SOURCE VOLTAGE (V) PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = 3V rDS(ON), DRAIN TO SOURCE ON RESISTANCE (m) VGS = 4V
25
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX
20 ID = 1A 15 ID = 10A 10
5 2 4 6 8 10 VGS, GATE TO SOURCE VOLTAGE (V)
FIGURE 7. SATURATION CHARACTERISTICS
FIGURE 8. DRAIN TO SOURCE ON RESISTANCE vs GATE VOLTAGE AND DRAIN CURRENT
1.6 NORMALIZED DRAIN TO SOURCE ON RESISTANCE PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX 1.4 VGS = 10V, ID = 10A NORMALIZED GATE THRESHOLD VOLTAGE
1.2 VGS = VDS, ID = 250A
1.0
1.2
0.8
1.0
0.6
0.8
0.6 -80
-40
0
40
80
120
160
0.4 -80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE (oC)
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE
4
ITF86116SQT Typical Performance Curves
1.10 NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE ID = 250A CISS = CGS + CGD
(Continued)
3000
1.05
C, CAPACITANCE (pF)
1000
COSS CDS + CGD
1.00
0.95
CRSS = CGD 0.90 -80 VGS = 0V, f = 1MHz -40 0 40 80 120 160 100 0.1 1.0 10 30
TJ , JUNCTION TEMPERATURE (oC)
VDS , DRAIN TO SOURCE VOLTAGE (V)
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE vs JUNCTION TEMPERATURE
FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
10 VGS , GATE TO SOURCE VOLTAGE (V) VDD = 15V 8 200 SWITCHING TIME (ns) 6 tr 150 250 VGS = 4.5V, VDD = 15V, ID = 5.0A
4 WAVEFORMS IN DESCENDING ORDER: ID = 9A ID = 1A 0 10 20 Qg, GATE CHARGE (nC) 30 40
100
tf
2
50 td(ON) 0 0 10 20 30 40
td(OFF)
0 50
RGS, GATE TO SOURCE RESISTANCE ()
NOTE: Refer to Intersil Application Notes AN7254 and AN7260. FIGURE 13. GATE CHARGE WAVEFORMS FOR CONSTANT GATE CURRENT FIGURE 14. SWITCHING TIME vs GATE RESISTANCE
250 VGS = 10V, VDD = 15V, ID = 10A SWITCHING TIME (ns) 200 td(OFF) 150 tf 100 tr 50 td(ON) 0 0 10 20 30 40 50 RGS, GATE TO SOURCE RESISTANCE ()
FIGURE 15. SWITCHING TIME vs GATE RESISTANCE
5
ITF86116SQT Test Circuits and Waveforms
VDS RL VDD VDS VGS = 10V VGS
+
Qg(TOT)
DUT Ig(REF)
VDD VGS VGS = 1V 0 Qg(TH) Qgs Ig(REF) 0
Qg(5) VGS = 5V
Qgd
FIGURE 16. GATE CHARGE TEST CIRCUIT
FIGURE 17. GATE CHARGE WAVEFORMS
tON RL VDS VGS VGS
+
tOFF td(OFF) tr tf 90%
td(ON) VDS
90%
0V RGS DUT 0 10% 90% VGS 0 10% 50% PULSE WIDTH 50% 10%
FIGURE 18. SWITCHING TIME TEST CIRCUIT
FIGURE 19. SWITCHING TIME WAVEFORM
Thermal Resistance vs Mounting Pad Area
The maximum rated junction temperature, TJM, and the thermal resistance of the heat dissipating path determines the maximum allowable device power dissipation, PDM, in an application. Therefore the application's ambient temperature, TA (oC), and thermal resistance RJA (oC/W) must be reviewed to ensure that TJM is never exceeded. Equation 1 mathematically represents the relationship and serves as the basis for establishing the rating of the part.
( T JM - T A ) P DM = -----------------------------Z JA
1. Mounting pad area onto which the device is attached and whether there is copper on one side or both sides of the board. 2. The number of copper layers and the thickness of the board. 3. The use of external heat sinks. 4. The use of thermal vias. 5. Air flow and board orientation. 6. For non steady state applications, the pulse width, the duty cycle and the transient thermal response of the part, the board and the environment they are in. Intersil provides thermal information to assist the designer's preliminary application evaluation. Figure 20 defines the RJA for the device as a function of the top copper (component side) area. This is for a horizontally positioned FR-4 board with 1oz copper after 1000 seconds of steady state power with no air flow. This graph provides the necessary information for calculation of the steady state
(EQ. 1)
In using surface mount devices such as the TSSOP-8 package, the environment in which it is applied will have a significant influence on the part's current and maximum power dissipation ratings. Precise determination of PDM is complex and influenced by many factors:
6
ITF86116SQT
junction temperature or power dissipation. Pulse applications can be evaluated using the Intersil device Spice thermal model or manually utilizing the normalized maximum transient thermal impedance curve. Displayed on the curve are RJA values listed in the Electrical Specifications table. The points were chosen to depict the compromise between the copper board area, the thermal resistance and ultimately the power dissipation, PDM . Thermal resistances corresponding to other copper areas can be obtained from Figure 20 or by calculation using Equation 2. RJA is defined as the natural log of the area times a coefficient added to a constant. The area, in square inches is the top copper area including the gate and source pads.
R JA = 97.5 - 20.2 * ln ( Area ) (EQ. 2)
Copper pad area has no perceivable effect on transient thermal impedance for pulse widths less than 100ms. For pulse widths less than 100ms the transient thermal impedance is determined by the die and package. Therefore, CTHERM1 through CTHERM5 and RTHERM1 through RTHERM5 remain constant for each of the thermal models. A listing of the model component values is available in Table 1.
240 220 200 RJA (oC/W) 180 160 140 120 165.4oC/W - 0.035in2 RJA = 97.5 - 20.2 * 206.8oC/W - 0.0045in2
ln (AREA)
The transient thermal impedance (ZJA) is also effected by varied top copper board area. Figure 21 shows the effect of copper pad area on single pulse transient thermal impedance. Each trace represents a copper pad area in square inches corresponding to the descending list in the graph. Spice and SABER thermal models are provided for each of the listed pad areas.
100 80 0.001 0.1 0.01 AREA, TOP COPPER AREA (in2) 1.0
FIGURE 20. THERMAL RESISTANCE vs MOUNTING PAD AREA
150 COPPER BOARD AREA - DESCENDING ORDER 0.04 in2 0.28 in2 0.52 in2 0.76 in2 1.00 in2
ZJA, THERMAL IMPEDANCE (oC/W)
100
50
0 10-1 100 101 t, RECTANGULAR PULSE DURATION (s) 102 103
FIGURE 21. THERMAL IMPEDANCE vs MOUNTING PAD AREA
7
ITF86116SQT PSPICE Electrical Model
.SUBCKT ITF86116SQT 2 1 3 ;
CA 12 8 1.55e-9 CB 15 14 1.65e-9 CIN 6 8 1.65e-9
LDRAIN
REV 29 Dec 1999
DBODY 7 5 DBODYMOD DBREAK 5 11 DBREAKMOD DESD1 91 9 DESD1MOD DESD2 91 7DESD2MOD DPLCAP 10 5 DPLCAPMOD EBREAK 11 7 17 18 38.78 EDS 14 8 5 8 1 EGS 13 8 6 8 1 ESG 6 10 6 8 1 EVTHRES 6 21 19 8 1 EVTEMP 20 6 18 22 1
LGATE
DPLCAP 10 RSLC2
5 DBREAK RLDRAIN
DRAIN 2 RSLC1 51 ESLC 50 EBREAK
5 51
ESG + GATE 1 RLGATE DESD1 91 DESD2 CIN EVTEMP 9 RGATE + 18 22 20 6 8 EVTHRES + 19 8 6
IT 8 17 1 LDRAIN 2 5 1.00e-9 LGATE 1 9 1.04e-9 LSOURCE 3 7 1.29e-10 MMED 16 6 8 8 MMEDMOD MSTRO 16 6 8 8 MSTROMOD MWEAK 16 21 8 8 MWEAKMOD
MSTRO LSOURCE 8 RSOURCE RLSOURCE 7 SOURCE 3
RBREAK 17 18 RBREAKMOD 1 RDRAIN 50 16 RDRAINMOD 2.40e-3 RGATE 9 20 1.37 RLDRAIN 2 5 10 RLGATE 1 9 9 10.4 RLSOURCE 3 7 1.29 RSLC1 5 51 RSLCMOD 1e-6 RSLC2 5 50 1e3 RSOURCE 8 7 RSOURCEMOD 3.50e-3 RVTHRES 22 8 RVTHRESMOD 1 RVTEMP 18 19 RVTEMPMOD 1 S1A S1B S2A S2B 6 12 13 8 S1AMOD 13 12 13 8 S1BMOD 6 15 14 13 S2AMOD 13 15 14 13 S2BMOD
S1A 12 S1B CA 13 + EGS 6 8 13 8
S2A 14 13 S2B CB + EDS 5 8 14 IT 15 17
-
-
VBAT 22 19 DC 1 ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*320),2))} .MODEL DBODYMOD D (IS = 2.15e-12 RS = 4.73e-3 TRS1 = 1.51e-3 TRS2 = 1.06e-6 CJO = 1.16e-9 TT = 2.19e-8 M = 0.50) .MODEL DBREAKMOD D (RS = 8.99e-2 TRS1 = -1.74e-3 TRS2 = 2.86e-5) .MODEL DESD1MOD D (BV = 9.7 Tbv1= -2.72e-3 N= 16 RS = 25) .MODEL DESD2MOD D (BV = 15.6 Tbv1= -2.17e-3 N= 13 RS = 25) .MODEL DPLCAPMOD D (CJO = 8.50e-10 IS = 1e-30 M = 0.50) .MODEL MMEDMOD NMOS (VTO = 2.30 KP = 3.50 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 1.37) .MODEL MSTROMOD NMOS (VTO = 2.89 KP =125 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u) .MODEL MWEAKMOD NMOS (VTO = 2.05 KP = 0.10 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 13.7 RS = 0.1) .MODEL RBREAKMOD RES (TC1 = 7.98e-4 TC2 = -9.15e-7) .MODEL RDRAINMOD RES (TC1 = 8.78e-3 TC2 = 8.98e-6) .MODEL RSLCMOD RES (TC1 = 9.15e-4 TC2 = 1.22e-6) .MODEL RSOURCEMOD RES (TC1 = 1.00e-3 TC2 = 0) .MODEL RVTHRESMOD RES (TC1 = -3.55e-3 TC2 = -6.24e-6) .MODEL RVTEMPMOD RES (TC1 = -1.66e-3 TC2 = 0) .MODEL S1AMOD VSWITCH (RON = 1e-5 .MODEL S1BMOD VSWITCH (RON = 1e-5 .MODEL S2AMOD VSWITCH (RON = 1e-5 .MODEL S2BMOD VSWITCH (RON = 1e-5 .ENDS ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 VON = -4.0 VOFF= -2.8) VON = -2.8 VOFF= -4.0) VON = -2.5 VOFF= 0) VON = 0 VOFF= -2.5)
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
8
+
11 + 17 18
-
RDRAIN 16 21
DBODY
MWEAK
MMED
RBREAK 18 RVTEMP 19
VBAT +
8 22 RVTHRES
ITF86116SQT SABER Electrical Model
REV 29 Dec 1999 template ITF86116SQT n2,n1,n3 electrical n2,n1,n3 { var i iscl dp..model dbodymod = (is = 2.15e-12,rs=4.73e-3,trs1=1.51e-3,trs2=1.06e-6, cjo = 1.16e-9, tt = 2.19e-8, m = 0.50) dp..model dbreakmod = (rs=8.99e-2,trs1=-1.74e-3,trs2=2.86e-5) dp..model desd1mod = (bv=9.7,tbv1=-2.72e-3,n1=16, rs=25) dp..model desd2mod = (bv=15.6,tbv1=-2.17e-3,n1=13, rs=25) dp..model dplcapmod = (cjo = 8.50e-10, is = 1e-30, m = 0.50) m..model mmedmod = (type=_n, vto = 2.30, kp = 3.50, is = 1e-30, tox = 1) m..model mstrongmod = (type=_n, vto = 2.89, kp = 125, is = 1e-30, tox = 1) DPLCAP 5 m..model mweakmod = (type=_n, vto = 2.05, kp = 0.10, is = 1e-30, tox = 1) 10 sw_vcsp..model s1amod = (ron = 1e-5, roff = 0.1, von = -4.0, voff = -2.8) sw_vcsp..model s1bmod = (ron = 1e-5, roff = 0.1, von = -2.8, voff = -4.0) RSLC1 sw_vcsp..model s2amod = (ron = 1e-5, roff = 0.1, von = -2.5, voff = 0) 51 sw_vcsp..model s2bmod = (ron = 1e-5, roff = 0.1, von = 0, voff = -2.5) RSLC2 c.ca n12 n8 = 1.55e-9 c.cb n15 n14 = 1.65e-9 c.cin n6 n8 = 1.65e-9 dp.dbody n7 n71 = model=dbodymod dp.dbreak n72 n11 = model=dbreakmod dp.desd1 n91 n9 = model=desd1mod dp.desd2 n91 n7 = model=desd2mod dp.dplcap n10 n5 = model=dplcapmod i.it n8 n17 = 1 l.ldrain n2 n5 = 1.00e-9 l.lgate n1 n9 = 1.04e-9 l.lsource n3 n7 = 1.29e-10
ESG + GATE 1 EVTEMP RGATE + 18 22 9 20 RLGATE DESD1 91 DESD2 LGATE 6 MSTRO CIN 8 RSOURCE RLSOURCE S1A 12 13 8 S1B 13 + EGS 6 8 EDS S2A 14 13 S2B CB + 5 8 14 IT 15 17 RBREAK 18 RVTEMP 19 ISCL DBREAK 11 DBODY MWEAK MMED EBREAK + 17 18
LDRAIN DRAIN 2 RLDRAIN
6 8 EVTHRES + 19 8
50 RDRAIN 21 16
-
LSOURCE 7
SOURCE 3
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u res.rbreak n17 n18 = 1, tc1 = 7.98e-4, tc2 = -9.15e-7 res.rdrain n50 n16 = 2.40e-3, tc1 = 8.78e-3, tc2 = 8.98e-6 res.rgate n9 n20 = 1.37 res.rldrain n2 n5 = 10 res.rlgate n1 n9 = 10.4 res.rlsource n3 n7 = 1.29 res.rslc1 n5 n51 = 1e-6, tc1 = 9.15e-4, tc2 = 1.22e-6 res.rslc2 n5 n50 = 1e3 res.rsource n8 n7 = 3.50e-3, tc1 = 1.00e-3, tc2 = 0 res.rvtemp n18 n19 = 1, tc1 = -1.66e-3, tc2 = 0 res.rvthres n22 n8 = 1, tc1 = -3.55e-3, tc2 = -6.24e-6 spe.ebreak n11 n7 n17 n18 = 38.78 spe.eds n14 n8 n5 n8 = 1 spe.egs n13 n8 n6 n8 = 1 spe.esg n6 n10 n6 n8 = 1 spe.evtemp n20 n6 n18 n22 = 1 spe.evthres n6 n21 n19 n8 = 1 sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod v.vbat n22 n19 = dc=1
CA
VBAT +
-
-
8 RVTHRES
22
equations { i (n51->n50) +=iscl iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/320))** 2)) } }
9
ITF86116SQT SPICE Thermal Model
REV 27 Dec 1999 ITF86116SQT Copper Area = 0.04 in2 CTHERM1 th 8 1.50e-3 CTHERM2 8 7 5.00e-3 CTHERM3 7 6 1.00e-2 CTHERM4 6 5 2.00e-2 CTHERM5 5 4 5.00e-2 CTHERM6 4 3 1.20e-1 CTHERM7 3 2 2.50e-1 CTHERM8 2 tl 1.30 RTHERM1 th 8 0.15 RTHERM2 8 7 0.50 RTHERM3 7 6 1.25 RTHERM4 6 5 8.00 RTHERM5 5 4 12.00 RTHERM6 4 3 26.00 RTHERM7 3 2 39.00 RTHERM8 2 tl 49.5
th JUNCTION
RTHERM1 8
CTHERM1
RTHERM2 7
CTHERM2
RTHERM3 6
CTHERM3
RTHERM4
CTHERM4 5
SABER Thermal Model
Copper Area = 0.04 in2 template thermal_model th tl thermal_c th, tl { ctherm.ctherm1 th 8 = 1.50e-3 ctherm.ctherm2 8 7 = 5.00e-3 ctherm.ctherm3 7 6 = 1.00e-2 ctherm.ctherm4 6 5 = 2.00e-2 ctherm.ctherm5 5 4 = 5.00e-2 ctherm.ctherm6 4 3 = 1.20e-1 ctherm.ctherm7 3 2 = 2.50e-1 ctherm.ctherm8 2 tl = 1.30 rtherm.rtherm1 th 8 = 0.15 rtherm.rtherm2 8 7 = 0.50 rtherm.rtherm3 7 6 = 1.25 rtherm.rtherm4 6 5 = 8.00 rtherm.rtherm5 5 4 = 12.00 rtherm.rtherm6 4 3 = 26.00 rtherm.rtherm7 3 2 = 39.00 rtherm.rtherm8 2 tl = 49.50 }
RTHERM5 4 CTHERM5
RTHERM6 3
CTHERM6
RTHERM7 2
CTHERM7
RTHERM8
CTHERM8
tl
CASE
TABLE 1. THERMAL MODELS COMPONENT CTHERM6 CTHERM7 CTHERM8 RTHERM6 RTHERM7 RTHERM8 0.04 in2 1.20e-1 2.50e-1 1.30 26 39 49.5 0.28 in2 2.00e-1 4.80e-1 2.30 20 24 36.8 0.52 in2 2.80e-1 4.50e-1 2.20 15 21 39 0.76 in2 1.90e-1 3.90e-1 2.70 11 21 29.5 1.0 in2 2.00e-1 5.00e-1 3.00 12 18 25
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ITF86116SQT MO-153AA (TSSOP-8)
8 LEAD JEDEC MO-153AA TSSOP PLASTIC PACKAGE
E E1 8 A A1
INCHES SYMBOL A MIN 0.041 0.002 0.010 0.005 0.114 0.244 0.170 0.122 0.260 0.177 MAX 0.047 0.006 0.012
MILLIMETERS MIN 1.05 0.05 0.25 0.127 2.90 6.20 4.30 3.10 6.60 4.50 MAX 1.20 0.15 0.30 NOTES 2 3 4
e
D 5 4
A1 b c
b c
D E E1 e
0.004 IN 0.10mm
0.025 BSC 0.020 0.028
0.65 BSC 0.50 0.70
L 0o-8o 0.015 0.4 0.035 0.9
L
0.025 0.65 0.232 5.9 0.077 1.95
NOTES: 1. These dimensions are within allowable dimensions of Rev. E of JEDEC MO-153AA outline dated 10-97. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.006 inches (0.15mm) per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. Interlead flash and protrusions shall not exceed 0.010 inches (0.25mm) per side. 4. "L" is the length of terminal for soldering. 5. Controlling dimension: Millimeter 6. Revision 3 dated: 5-00.
MO-153AA (TSSOP-8)
12mm TAPE AND REEL
17.4mm 1.5mm DIA. HOLE 4.0mm 2.0mm 1.75mm C L 12mm 330mm 100mm
13mm
8.0mm USER DIRECTION OF FEED
13.4mm
COVER TAPE
GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
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ITF86116SQT
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